6.15-Class Thermally Conductive PTFE Laminate
FJY615B-M
High-Dk, low-loss material for compact, higher-power RF and microwave designs
FJY615B-M is a ceramic-filled PTFE laminate reinforced with woven glass for high-power RF and microwave circuits. Its 6.15-class dielectric platform balances circuit miniaturization, low transmission loss, dimensional stability and thermal management for designs evaluating Rogers AD600 or Taconic RF-60TC alternatives.
Key Performance
Designed around the electrical and mechanical variables that determine RF yield
FJY615B-M supports repeatable high-frequency performance from PCB fabrication through field operation.
Compact RF Geometry
A 6.15-class dielectric constant supports smaller antennas, filters and passive structures without moving to an ultra-high-Dk platform.
Improved Dielectric Heat Transfer
The thermally conductive composite helps reduce operating temperature around active devices and high-current RF transmission paths.
Stable Electrical Response
Low loss and stable dielectric behavior support antenna gain, filter response and signal efficiency across frequency and temperature.
Reliable Mechanical Platform
Woven-glass reinforcement and controlled thermal expansion improve dimensional stability, metal adhesion and PTH reliability.
Typical Technical Data
Core properties for initial material evaluation
Use these typical values for preliminary comparison and request the current product data sheet before final stack-up release.
| Property | Typical value / positioning | Design relevance |
|---|---|---|
| Dielectric constant (Dk) | 6.15 class at 10 GHz | Impedance geometry, phase velocity and circuit size |
| Dissipation factor (Df) | Low-loss grade | Dielectric attenuation and RF power efficiency |
| Moisture absorption | Low absorption | Electrical stability in humid operating environments |
| Thermal conductivity | Thermally conductive | Heat transfer through the dielectric |
| CTE, X / Y / Z | Low X/Y/Z expansion | Registration, thermal cycling and PTH reliability |
| Material construction | Ceramic-filled PTFE + woven glass | Electrical stability, handling and fabrication behavior |
Values are typical design references, not guaranteed specification limits. Final material substitution requires review of the current data sheet, copper configuration, thickness tolerance, PCB process and application-level validation.
Typical Applications
Application areas aligned with the material’s dielectric and thermal profile
High-power amplifiers
Miniaturized GPS and patch antennas
RFID reader antennas
Filters, couplers and power dividers
Satellite RF assemblies
Compact high-power microwave modules
Material Selection
When to specify FJY615B-M
Choose FJY615B-M when the project requires a compact 6.15-class RF layout together with lower dielectric loss, improved heat dissipation and stable long-term operation.
Selection reference
Evaluate the complete construction—not Dk alone—when qualifying a second source or migrating an established RF design.
- Jiuyao material
- FJY615B-M
- Comparable design class
- Rogers AD600 / Taconic RF-60TC
- Primary value
- Compact high-power RF
- Validation
- Stack-up + prototype + RF test
Start a Material Review
Evaluate FJY615B-M for your next RF design
Send your operating frequency, target impedance, core thickness, copper type, panel format and thermal environment. Our technical team will recommend a suitable configuration and sampling plan.