Thermally Enhanced Ceramic-Filled PTFE Laminate
FJY350B-TM
Low-loss RF performance with improved heat transfer for higher-power circuits
FJY350B-TM is a ceramic-filled, woven-glass-reinforced PTFE laminate engineered for RF and microwave designs where electrical efficiency and heat dissipation must be managed together. It is positioned for projects evaluating alternatives to Rogers TC350 and Taconic RF-35TC.
Key Performance
Designed around the electrical and mechanical variables that determine RF yield
FJY350B-TM supports repeatable high-frequency performance from PCB fabrication through field operation.
High-Power Thermal Management
The thermally enhanced dielectric system helps move heat away from transmission lines and surface-mounted RF power devices.
Controlled Low-Loss Performance
A 3.55 Dk platform with low dissipation supports efficient power delivery through amplifiers, dividers, filters and couplers.
Low Thermal Expansion
Balanced X/Y expansion and controlled Z-axis movement support registration, plated-through-hole reliability and thermal cycling.
Production-Oriented Reinforcement
Woven glass improves rigidity and dimensional control while supporting standard RF PCB fabrication workflows.
Typical Technical Data
Core properties for initial material evaluation
Use these typical values for preliminary comparison and request the current product data sheet before final stack-up release.
| Property | Typical value / positioning | Design relevance |
|---|---|---|
| Dielectric constant (Dk) | 3.55 class at 10 GHz | Impedance geometry, phase velocity and circuit size |
| Dissipation factor (Df) | 0.0020 | Dielectric attenuation and RF power efficiency |
| Moisture absorption | 0.02% | Electrical stability in humid operating environments |
| Thermal conductivity | Thermally enhanced | Heat transfer through the dielectric |
| CTE, X / Y / Z | 10 / 10 / 26 ppm/°C | Registration, thermal cycling and PTH reliability |
| Material construction | Ceramic-filled PTFE + woven glass | Electrical stability, handling and fabrication behavior |
Values are typical design references, not guaranteed specification limits. Final material substitution requires review of the current data sheet, copper configuration, thickness tolerance, PCB process and application-level validation.
Typical Applications
Application areas aligned with the material’s dielectric and thermal profile
High-power RF amplifiers
Power dividers and combiners
Filters and directional couplers
Satellite and aerospace RF modules
Industrial microwave heating equipment
Thermally demanding antenna networks
Material Selection
When to specify FJY350B-TM
Choose FJY350B-TM when conductor and dielectric losses must remain controlled while the PCB substrate also contributes to heat spreading around high-power RF devices.
Selection reference
Evaluate the complete construction—not Dk alone—when qualifying a second source or migrating an established RF design.
- Jiuyao material
- FJY350B-TM
- Comparable design class
- Rogers TC350 / Taconic RF-35TC
- Primary value
- Low loss and heat management
- Validation
- Stack-up + prototype + RF test
Start a Material Review
Evaluate FJY350B-TM for your next RF design
Send your operating frequency, target impedance, core thickness, copper type, panel format and thermal environment. Our technical team will recommend a suitable configuration and sampling plan.