Low-Loss Dimensionally Stable PTFE Laminate
FJY300B-M
A 3.0-class RF core for stable phase performance and multilayer construction
FJY300B-M is a ceramic-filled, woven-glass-reinforced PTFE laminate developed for low-loss RF, microwave and phase-sensitive multilayer PCB designs. It is positioned for projects evaluating alternatives to Rogers CLTE-AT and Taconic TSM-DS3.
Key Performance
Designed around the electrical and mechanical variables that determine RF yield
FJY300B-M supports repeatable high-frequency performance from PCB fabrication through field operation.
Low-Loss Signal Transmission
A low dissipation platform helps preserve insertion loss, gain and signal integrity through microwave feed networks and phase-sensitive circuits.
Stable Phase Performance
Controlled dielectric behavior supports repeatable electrical length across frequency and temperature in radar, phased-array and precision RF systems.
Multilayer Registration Control
Woven-glass reinforcement and low in-plane expansion improve dimensional predictability during multilayer lamination and fine-feature fabrication.
Thermal and PTH Reliability
Controlled expansion and a thermally enhanced ceramic-filled system support plated-through-hole durability under assembly and operating temperature cycles.
Typical Technical Data
Core properties for initial material evaluation
Use these typical values for preliminary comparison and request the current product data sheet before final stack-up release.
| Property | Typical value / positioning | Design relevance |
|---|---|---|
| Dielectric constant (Dk) | 3.00 class at 10 GHz | Impedance geometry, phase velocity and circuit size |
| Dissipation factor (Df) | 0.0014 class | Dielectric attenuation and RF power efficiency |
| Moisture absorption | Low absorption | Electrical stability in humid operating environments |
| Thermal conductivity | Thermally enhanced | Heat transfer through the dielectric |
| CTE, X / Y / Z | Low X/Y/Z expansion | Registration, thermal cycling and PTH reliability |
| Material construction | Ceramic-filled PTFE + woven glass | Electrical stability, handling and fabrication behavior |
Values are typical design references, not guaranteed specification limits. Final material substitution requires review of the current data sheet, copper configuration, thickness tolerance, PCB process and application-level validation.
Typical Applications
Application areas aligned with the material’s dielectric and thermal profile
Phased-array and radar antenna networks
Microwave manifolds and feed structures
Filters, couplers and power dividers
Millimeter-wave communication modules
Semiconductor ATE and precision RF fixtures
High-layer-count RF multilayer PCBs
Material Selection
When to specify FJY300B-M
Choose FJY300B-M when the design requires a 3.0-class low-loss RF laminate with strong dimensional stability, temperature-stable phase behavior and dependable registration in multilayer or thin-core constructions.
Selection reference
Evaluate the complete construction—not Dk alone—when qualifying a second source or migrating an established RF design.
- Jiuyao material
- FJY300B-M
- Comparable design class
- Rogers CLTE-AT / Taconic TSM-DS3
- Primary value
- Low loss and dimensional stability
- Validation
- Stack-up + prototype + RF test
Start a Material Review
Evaluate FJY300B-M for your next RF design
Send your operating frequency, target impedance, core thickness, copper type, panel format and thermal environment. Our technical team will recommend a suitable configuration and sampling plan.