FJY-TC350A was designed with high thermal conductivity laminate material. FJY-TC350A
is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. FJY-TC350A is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

FJY-TC350A material is an excellent choice for Power Amplifiers and other high power designs. Additional applications using this materials include critical higher power Passive Components (couplers, filters), sensitive to dielectric constant changes with temperature.

Features

• High Thermal Conductivity
• Dielectric Constant Stability Across Wide Temperature Range
• Low Loss Tangent
• Low CTE (X,Y,Z Axes)
• Available in Large Panel Format up to 48” x 54”

Benefits

• Reduced Junction Temperature and Improved Reliability
• Improved Bandwidth Utilization and Efficiency for Amplifiers & Antennas
• Reduced Heat Generation Through Transmission Line Loss
• Reliable for Attachment to Active Components and for Plated Vias
• Allows for PCB fabricator Processing Flexibility for Optimized Panel Size

Typical Applications

• High Power Amplifiers, Filters and Couplers
• Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
• Thermally Cycled, High Reliability Antennas Sensitive to Dielectric Drift
• Microwave Combiner and Power Dividers

FJY-TC350A Laminates

Printed circuit board substrates comprising PTFE, high thermally conductive ceramic fillers and woven glass reinforcement.