PCB Project

Number of layers:4 layers

Thickness:1.0mm

Min. hole:0.4mm

Base material:HJY350A(replace RO4350B)+FR-4

Technical Feature: Blind hole, mix lamination

Number of layers:4 layers

Thickness:0.6mm

Min. hole:0.3mm

Base material:FJY300B-M(replace TSM-DS3)+FJY270B-M-PP(replace FR-28)

Technical Feature: Planar embedded resistor in inner layer, step

Number of layers:4 layers

Thickness:0.8mm

Min. hole:3mm

Base material:FJY220A-M(replace RT5880)+FR-4

Technical Feature: Mix lamination of FR-4 and PTFE

Number of layers:12 layers

Thickness:3.6mm

Min. hole:0.6mm

Base material:FJY220A-M(replace RT5880)

Technical Feature: High frequency,high reliability,press fit, backdrill

Number of layers:4 layers

Thickness:1.8mm

Min. hole:1.0mm

Base material:HJY340A(replace RO4534)

Technical Feature: Mix lamination of FR-4 and Hydrocarbon

Number of layers:1 layers

Thickness:1.5mm

Min. hole:0.8mm

Base material:1mm Copper Based Material+0.5mm PTFE Material

Technical Feature: Heat dissipation, high frequency

Number of layers:1 layers

Thickness:5.3mm

Min. hole:3.0mm

Base material:Aluminum Based Material+PTFE Material

Technical Feature: Heat dissipation,high frequency,step