FJY270B-M-PP Prepreg Series

Dk 2.74 | Df 0.0014 | Zero Glass Weave Skew | FastRise™-28 Alternative

A game-changer for high-speed digital and millimeter-wave (mmWave) multilayer packaging. FJY270B-M-PP is a non-reinforced, thermosetting prepreg that completely eradicates the micro-Dk variations caused by woven fiberglass. Empowering RF architects to build highly complex, phase-stable stripline assemblies and HDI modules.

Head-to-Head Specification Comparison

Key ParameterJIUYAO FJY270B-M-PP
(Non-Reinforced Matrix)		Arlon FastRise™-28
(The Benchmark)		Engineering Insight (Why it matters)
Dielectric Constant (Dk)
@ 10 GHz		2.74 ± 0.042.74 ± 0.04Exact Match. Unmatched phase predictability. Ready as a drop-in equivalent for existing RF module designs.
Dissipation Factor (Df)
@ 10 GHz		0.00140.0014Ultra-Low Loss. Preserves critical signal integrity in dense mmWave packaging and high-speed digital backplanes.
Fiberglass Content
Reinforcement Type		0%
(Non-Reinforced)		0%
(Non-Reinforced)		Eliminates phase variation and differential pair skew entirely. Creates a perfectly homogenous dielectric layer.
Laser Drillability
Micro-Via Formation		ExcellentExcellentPure resin matrix allows for flawless laser ablation, enabling dense High-Density Interconnect (HDI) structures.
Lamination Capability
Multilayer Build-up		Sequential HDI Ready
(Thermoset Flow)		Sequential HDI ReadyBonds at significantly lower temperatures compared to pure PTFE, preventing thermal damage to previously pressed inner layers.

*FastRise™ is a trademark of Arlon Electronic Materials / Rogers Corporation. Data is for technical reference only.

The Engineering Logic Behind FJY270B-M-PP

Eradicating Glass Weave Skew

In applications above 24GHz, woven fiberglass causes localized variations in the dielectric constant (Micro-Dk), leading to unpredictable phase shifts. As a 100% non-reinforced homogenous matrix, FJY270B-M-PP guarantees absolute phase consistency across the entire panel, making it indispensable for phased array radars.

Superior Sequential Lamination

Building 3D RF modules requires multiple lamination cycles. Pure PTFE prepregs demand extreme bonding temperatures that can warp panels. FJY270B-M-PP is a thermoset system that flows and cures at much lower temperatures, enabling high-yield sequential lamination for HDI boards without destroying existing structures.

Flawless Micro-Via Formation

The absence of woven glass eliminates the common "glass protruding" defects encountered during mechanical and laser drilling. Fabricators can cleanly ablate micro-vias through the FJY270B-M-PP dielectric layer, ensuring smooth via walls and highly reliable copper plating for dense interconnects.

Ideal Applications for Zero-Skew Prepreg

mmWave Chip Packaging & RF Modules
Automotive 77GHz / 79GHz Radar Sensors
High-Speed Digital (HSD) Backplanes
Military Phased Array Radars (AESA)
Complex HDI & Sequential Lamination Boards

Master Complex RF Packaging.

Request lamination guidelines and material samples to validate FJY270B-M-PP in your next HDI design.

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Frequently Asked Questions (FAQ)

Why is a "Non-Reinforced" prepreg necessary for mmWave applications?
Standard prepregs use woven fiberglass for structural support. At frequencies above 24GHz (like 77GHz automotive radar), the difference in dielectric constant between the glass bundles and the pure resin creates "Micro-Dk Variations." This causes severe phase skew and signal distortion. FJY270B-M-PP is 100% pure thermosetting resin (0% glass), ensuring a perfectly uniform Dk of 2.74 and eliminating phase skew entirely.
How does FJY270B-M-PP perform with Laser Drilling for Micro-vias?
It performs exceptionally well. Because there is no woven glass reinforcement, the laser ablation process is incredibly clean and consistent. There are no glass fibers to deflect the laser beam or protrude into the via wall. This results in perfectly smooth micro-vias, which is critical for reliable copper plating in High-Density Interconnect (HDI) designs.
Is this material suitable for Sequential Lamination (multiple press cycles)?
Yes, it is designed specifically for this. Pure PTFE prepregs require extremely high bonding temperatures (often above 370°C) which can melt existing vias and warp inner layers. FJY270B-M-PP is a thermosetting system that flows and cures at much lower, standard pressing temperatures. This allows fabricators to safely perform multiple sequential lamination cycles for complex 3D RF modules.
What core laminates can I bond this prepreg with?
FJY270B-M-PP is highly versatile. It provides excellent adhesion to a wide variety of core materials, including pure PTFE laminates (like our FJY294B-M), hydrocarbon-ceramic cores (like our HJY340A-M), and standard FR-4. This makes it the ideal bonding layer for high-frequency/high-speed digital hybrid multilayer stack-ups.