Dielectric Constant (Dk)
3.50 ±0.05
@ 10 GHz (Cavity Resonator / IPC-TM-650)
Dissipation Factor (Df)
0.0035
@ 10 GHz (Low Loss)
PIM
less than -158 dBc
Standard Sulfuric Acid Desmear
Process Compatibility
NO PLASMA
Standard Sulfuric Acid Desmear
1. Material Properties & Competitor Benchmark
Data verified by independent 3rd-party qualification .
| Property | Test Method / Condition | Unit | HJY350A-M (Typ.) | RO4350B(Ref.) |
|---|---|---|---|---|
| Dielectric Constant | 10 GHz, Cavity Method | - | 3.50 ± 0.05 | 3.48 ± 0.05 |
| Dissipation Factor | 10 GHz | - | 0.0035 | 0.0037 |
| Thermal Conductivity | ASTM D5470 | W/m/K | 0.60 | 0.69 |
| Peel Strength (Copper) | 1 oz, As Received | N/mm | 1.209 | 0.88 |
| Peel Strength (Thermal) | After 288°C Solder Float | N/mm | 0.887 | 0.88 |
| Water Absorption | D48/50 | % | 0.06 | 0.05 |
| Z-Axis CTE | -55°C to 288°C | ppm/°C | 31 | 32 |
2. Reliability & Environmental Testing
Thermal Stress Analysis
Method: Solder Float @ 288°C ±5°C for 10 seconds.
- Surface: PASS (No blistering/delamination)
- Cross-section: PASS (No interconnection separation) [cite: 173, 233]
- Reflow Simulation: PASS (5 Cycles Lead-Free) [cite: 236]
Chemical Resistance
Method: Immersion followed by Insulation Resistance (IR) test.
- Concentrated Acid (H2SO4): IR ≥ 500MΩ (15 min immersion) [cite: 131]
- Strong Alkali (NaOH): IR ≥ 500MΩ (60 min immersion)
- Engineering implication: Fully compatible with aggressive wet-process chemistry without degradation.
3. PCB Fabrication Guidelines (Process Engineering)
HJY350A-M is designed to utilize standard FR-4 process parameters, significantly reducing fabrication costs compared to PTFE-based laminates.
- Drilling: The ceramic filler is optimized for drill bit longevity. Micro-section analysis confirms hole roughness ≤ 25µm and wicking ≤ 80µm.
- Desmear (Critical): Unlike competitive materials requiring Plasma Etch, HJY350A-M is compatible with standard alkaline permanganate or concentrated sulfuric acid desmear cycles[cite: 6]. No specialized equipment is required.
- Plating: Compatible with Electroless Nickel Immersion Gold (ENIG), HASL, and Immersion Tin. No "pad lifting" or "wicking" observed after plating processes[cite: 191].
- Multilayer Lamination: Compatible with standard high-Tg FR-4 prepregs for hybrid stack-ups.
Frequently Asked Questions (FAQ)
Can I use my existing RO4350B™ Gerber files for HJY350A-M?
Yes, absolutely. HJY350A-M has a Dielectric Constant (Dk) of 3.50 ± 0.05, which is functionally equivalent to RO4350B.
Internal testing and customer verification confirm that 50Ω single-ended and 100Ω differential impedance lines designed for Dk 3.5 fall within the standard ±10% tolerance. No layout modification is required.
Internal testing and customer verification confirm that 50Ω single-ended and 100Ω differential impedance lines designed for Dk 3.5 fall within the standard ±10% tolerance. No layout modification is required.
Does HJY350A-M require Plasma Treatment for via preparation?
No. Unlike PTFE-based materials, HJY350A-M is a ceramic-filled hydrocarbon laminate that is fully compatible with standard FR-4 processes.
It can be processed using standard concentrated sulfuric acid or alkaline permanganate desmear cycles. This eliminates the need for specialized plasma equipment and reduces fabrication cycle time.
It can be processed using standard concentrated sulfuric acid or alkaline permanganate desmear cycles. This eliminates the need for specialized plasma equipment and reduces fabrication cycle time.
Is this material suitable for 5G Base Station applications?
Yes. The material is optimized for carrier-grade RF performance with a Passive Intermodulation (PIM) rating of < -158 dBc.
Additionally, its low Dissipation Factor (Df 0.0035) ensures minimal signal loss, making it ideal for Power Amplifiers (PA) and Antenna arrays.
Additionally, its low Dissipation Factor (Df 0.0035) ensures minimal signal loss, making it ideal for Power Amplifiers (PA) and Antenna arrays.
How does the material perform under thermal stress and reflow?
HJY350A-M demonstrates exceptional thermal robustness. It passes the 288°C Solder Float test (10 seconds) with no delamination or blistering.
It has also been qualified through 5 cycles of lead-free reflow without failure, ensuring reliability for complex multilayer assemblies.
It has also been qualified through 5 cycles of lead-free reflow without failure, ensuring reliability for complex multilayer assemblies.
Can HJY350A-M be used in hybrid multilayer stack-ups?
Yes. It is compatible with standard High-Tg FR-4 prepregs. Its Z-axis Coefficient of Thermal Expansion (CTE) is 31 ppm/°C, which is closely matched to copper, ensuring reliable plated through-hole (PTH) performance in hybrid constructions.